The Chips Joint Undertaking (Chips JU) has announced the launch of two new calls for proposals focused on Advanced Packaging, as part of the “Lab to Fab Accelerators” program. To support the formation of consortia and disseminate detailed information about these calls, EPOSS is organizing an in-person brokerage event on September 18.

The event “Pre-Brokerage for Lab to Fab Accelerator projects on Advanced Packaging” will take place in Grenoble, France, at the World Trade Center, between 3:30 p.m. and 5:30 p.m. (CEST). The session will take place as part of the 25th edition of the European Microelectronics & Packaging Conference (EMPC 2025). This initiative aims to inform the community about new funding opportunities and facilitate the creation of strategic partnerships between potential stakeholders. The preliminary version of the call for proposals was published on September 2 and can be found here.

Registration for the event is now open and must be completed via the registration platform. Participation is exclusively in person. For those interested who are unable to attend in Grenoble, the organization suggests contacting the EPoSS Office via email at contact@smart-systems-integration.org for more information about competitions and funding opportunities.